Leaked A20 Pro Chip Image Suggests Major iPhone 18 Pro Performance Gains

Executive Briefing

• Reveals A20 Pro adopting TSMC's Wafer-Level Multi-Chip Module (WMCM) packaging, moving DRAM beside the processor to reduce heat.
• Shows significantly enlarged Neural Processing Unit, signaling Apple's push for stronger on-device AI capabilities.
• Indicates LPDDR6 memory with 96-bit bus and TSMC's 2nm process, promising up to 15% speed and 30% efficiency gains.
• Confirms iPhone 18 Pro, Pro Max, and foldable models expected to share 12GB RAM, 48MP cameras, and Apple's C2 modem.
• Leaked image remains unverified but aligns with multiple prior rumors; September 2026 launch anticipated.